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算力基础设施的重中之重:AI芯片的互联网络

The Top Priority of Computing Infrastructure: The Interconnection Network for AI Chips

  • 摘要: 随着AI 芯片算力与能效的提升,系统级瓶颈已从单芯片迁移至跨芯片、跨节点与跨域的互联与系统协同问题。本文将算力互联按作用域划分为 Scale-Up、Scale-Out与Scale-Across,总结了各类方案的实现路径,并指出互联硬件、拥塞控制、负载均衡、通信库与调度运维是规模化部署的核心挑战。基于此,提出以软硬件协同为核心的路线:推进交换机-RNIC 协同遥测与控制、在通信库与调度器间建立拓扑与链路能力的闭环,并通过标准化与渐进式工程化部署兼顾性能与可维护性,同时补强算子库与工具链以缩小生态差距。最后讨论了未来研究方向,包括端网更紧密的协同、互联方案可维护性改进与产业级标准化。

     

    Abstract: With the advancement of computing power and energy efficiency of AI chips, the system-level bottleneck has shifted from individual chips to the interconnection and system coordination issues across chips, nodes, and domains. This article classifies computing power interconnections into Scale-Up, Scale-Out, and Wide-Area Interconnection based on their scope of operation, summarizes the implementation paths of various solutions, and identifies that interconnection hardware, congestion control, load balancing, communication libraries, scheduling and operations are the core challenges for large-scale deployment. Based on this, a roadmap centered on hardware-software co-design is proposed: advancing switch-RNIC collaborative telemetry and control, establishing a closed loop of topology and link between communication libraries and schedulers, balancing performance and maintainability through standardization and incremental deployment, and enhancing operator libraries and toolchains to narrow the ecosystem gap. Finally, future research directions are discussed, including tighter end-network collaboration, improved maintainability of interconnection solutions, and industry-level standardization.

     

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