Abstract: As the scaling benefits of Moore’s Law diminish, the global semiconductor industry has entered the post-Moore era, characterized by diversified technological pathways. In October 2024, the 20th session of the CCF Beautiful Lake Seminar, themed “new opportunities for integrated circuit development in the post-Moore era”, brought together over 20 experts from academia and industry to explore four critical frontiers: processor instruction set ecosystems, novel chip architectures, EDA innovations, and advanced packaging technologies. The conference highlighted that building autonomous artificial intelligence(AI) software-hardware ecosystems, overcoming challenges in emerging memory and Computing in Memory technologies, promoting global open-source chip ecosystems, and developing next-generation intelligent EDA tools for integrated chips, quantum and optical computing will be pivotal for breakthroughs in the post-Moore era. Through interdisciplinary collaboration and industrial chain integration, China is poised to achieve leapfrog advancements in AI computing power, chip architecture, and ecosystem development, offering a “Chinese blueprint” for global semiconductor innovation. This article synthesizes key insights and consensus from the seminar, outlining future technological trends and their transformative impact on the industry.